Yanfeng Zhang's Location
Shanghai, Shanghai, China
Yanfeng Zhang's Work
- Research and Development Engineer @ UTAC
- Senior Beol Process Integration Engineer @ GlobalFoundries
- Process Integration Engineer @ SMIC
Yanfeng Zhang's Education
- Shanghai Institute of Ceramics, Chinese Academy of Sciences
Masters (Engineering)
2002 - 2005 - Nanjing University of Technology
Bachelors (Engineering)
1998 - 2002
Yanfeng Zhang's Skills
- Packaging
- Tsv
- 40nm
- Semiconductor Manufacturing
- Chip Package Interaction
- Fcbga
- Characterization
- Far Beol
- Osats Management
- Beol
Yanfeng Zhang's Summary
Yanfeng Zhang, based in Shanghai, Shanghai, China, is currently a Principal Engineer at Huawei Hisilicon, bringing experience from previous roles at Huawei Technologies, Amd, Utac and Globalfoundries. Yanfeng Zhang holds a 2002 - 2005 Masters in Engineering @ Shanghai Institute of Ceramics, Chinese Academy of Sciences. With a robust skill set that includes Packaging, Tsv, 40nm, Semiconductor Manufacturing, Chip Package Interaction and more, Yanfeng Zhang contributes valuable insights to the industry. Yanfeng Zhang has 1 email on RocketReach.
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