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Xing Xing Location
Palo Alto, CA, US
Xing Xing Work
2026 -now Principle Engineer and manager, Advanced packaging @
2025 -2026 Interposer design manager and IPD lead @
2016 -2025 IC Packaging and IPD Engineer @
2011 -2016 Staff Device Engineer @
2011 -2011 Isolator Intern @
2014 -2014 Session Chair of IEEE Power Electronics Conf. @ 2014 International Workshop on Power Supply on Chip (PwrSoC)
2007 -2011 Research Assistant @
Xing Xing Education
Northeastern University
PhD (Electrical Engineering)
2006-2011
Nanjing University
BS (Physics)
2002-2006
Xing Xing Skills
Integrated magnetic core transformer
High voltage isolation
Energy Harvesting
ADI iCoupler technology
Magnetic Antennas
Photolithography
MEMS
Characterization
Semiconductors
Nanofabrication
AFM
Microfabrication
Nanotechnology
Magnetics
Thin Films
Digital Isolator
Integrated transformer modeling
EMI simulation
IC
Matlab
Simulations
Engineering Management
HFSS, Q3D, Momentum
RF Antennas
EMI modeling
SI(signal integrity)
Physics
Sensors
LabVIEW
PCB Design
Project Management
HFSS
Management
Sisignal Integrity
Social Media
Q3d
Momentum
Xing Xing Summary
Xing Xing, based in Palo Alto, CA, US, is currently a Principle Engineer and manager, Advanced packaging at Tenstorrent. Xing Xing brings experience from previous roles at Apple and Analog Devices. Xing Xing holds a 2006 - 2011 PhD in Electrical Engineering @ Northeastern University. With a robust skill set that includes Integrated magnetic core transformer, High voltage isolation, Energy Harvesting, ADI iCoupler technology, Magnetic Antennas and more. Xing Xing has 4 emails and 3 mobile phone numbers on RocketReach.
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