Interposer design manager and IPD lead @ (May 2025 - January 2026)
IC Packaging and IPD Engineer @ (May 2016 - April 2025)
Staff Device Engineer @ (October 2011 - May 2016)
Isolator Intern @ (July 2011 - October 2011)
Session Chair of IEEE Power Electronics Conf. @ 2014 International Workshop on Power Supply on Chip (PwrSoC) (March 2014 - October 2014)
Research Assistant @ (September 2007 - June 2011)
Xing Xing Education
Northeastern University
PhD (Electrical Engineering)
2006-2011
Nanjing University
BS (Physics)
2002-2006
Xing Xing Skills
Integrated magnetic core transformer
High voltage isolation
Energy Harvesting
ADI iCoupler technology
Magnetic Antennas
Photolithography
MEMS
Characterization
Semiconductors
Nanofabrication
AFM
Microfabrication
Nanotechnology
Magnetics
Thin Films
Digital Isolator
Integrated transformer modeling
EMI simulation
IC
Matlab
Simulations
Engineering Management
HFSS, Q3D, Momentum
RF Antennas
EMI modeling
SI(signal integrity)
Physics
Sensors
LabVIEW
PCB Design
2.5D/3DIC design
ANSYS HFSS
Advanced packaging technology
Computer-Aided Design (CAD)
Engineering
Interposer design
Power Integrity
Power magnetics
Python (Programming Language)
Semiconductor Engineering
Signal Integrity
Silicon capacitors
Vector Network Analyzers (VNA)
Project Management
HFSS
Management
Sisignal Integrity
Social Media
Q3d
Momentum
Xing Xing Summary
Xing Xing, based in Palo Alto, CA, US, is currently a Principle Engineer and manager, Advanced packaging at Tenstorrent. Xing Xing brings experience from previous roles at Apple and Analog Devices. Xing Xing holds a 2006 - 2011 PhD in Electrical Engineering @ Northeastern University. With a robust skill set that includes Integrated magnetic core transformer, High voltage isolation, Energy Harvesting, ADI iCoupler technology, Magnetic Antennas and more. Xing Xing has 3 emails and 3 mobile phone numbers on RocketReach.
Looking for a different Xing Xing?
Find contact details for 700 million professionals.