Xiao Lu Email & Phone Number
Senior Director, CAM and SLAM and DXA and SMT Module, Advanced Packaging TD, Intel Foundry @ Intel Corporation
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Xiao Lu Location
- Chandler, AZ, US
Xiao Lu Work
- 2026 -now Senior Director, CAM and SLAM and DXA and SMT Module, Advanced Packaging TD, Intel Foundry @
- 2025 -2026 Senior Director, CAM and SLAM and DxA Module, ATTD, Intel Foundry @
- 2023 -2025 Sr. Principal Engineer, Advanced Packaging Assembly Sr. Director, CAM and SLAM, ATTD @
- 2018 -2023 Principal Engineer, Area Manager, SLI Assembly Module, ATTD @
- 2016 -2018 Group Leader, Chip Attach Module, ATTD @
- 2012 -2016 Staff Packaging Engineer, Chip Attach Module, ATTD @
- 2008 -2012 Senior Packaging Engineer, Mechanical Core Competency, ATTD @
- 2003 -2008 Graduate Research Assistant, Aeronautics Department @
Xiao Lu Education
- California Institute of Technology
Ph.D (Aeronautics, Major in Solid Mechanics)
2004-2008 - Caltech
M.S. with honor (Aeronautics)
2003-2004 - Tsinghua University
B.A. (Engineering Mechanics)
1999-2003
Xiao Lu Skills
- Electronics Packaging
- Mechanical analysis of silicon packages
- Flip-Chip packaging
- Surface-Mount technology
- 3D packaging
- Through-Silicon-Via technology
- Solid Mechanics
- Finite Element Analysis
- High-Speed imaging
- Photoelasticity
- Moiré Interferometry
- Material characterization
- Program Management
- Characterization
- Semiconductors
- Thermal
- Thin Films
- R&D
- Materials
- Metrology
- Packaging
- Intel
- Surface Mount Technology
- Engineering
- Mechanical Engineering
- Manufacturing
- Through Silicon Via Technology
- Flip Chip Packaging
- High Speed Imaging
- Research
Xiao Lu Summary
- Xiao Lu, based in Chandler, AZ, US, is currently a Senior Director, CAM and SLAM and DXA and SMT Module, Advanced Packaging TD, Intel Foundry at Intel Corporation. Xiao Lu brings experience from previous roles at Intel Corporation. Xiao Lu holds a 2004 - 2008 Ph.D in Aeronautics, Major in Solid Mechanics @ California Institute of Technology. With a robust skill set that includes Electronics Packaging, Mechanical analysis of silicon packages, Flip-Chip packaging, Surface-Mount technology, 3D packaging and more. Xiao Lu has 4 emails and 1 mobile phone numbers on RocketReach.
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