1. Analyzed and fault isolated the returned materials using Curve Tracer, Parametric Analyzer, Micro Probing, Scanning Electron Microscope (SEM), IR/UV microscope, Hamamatsu Photonic System (Optical Beam Induced Resistance Change (OBIRCH) & Emission Microscopy), Elite Lock-in Thermography & Checkpoint InfraScan. 2. Performed design layout and schematic review to validate the faulty location of the returned device. 3. Closely work with physical FA engineers, FIB Engineer and technicians to achieve successful physical FA. 4. In addition to supporting FA to different Business units, became main principle FA engineer on the customer returns and reliability stress failures of power management devices for server applications and battery power management devices. 5. Gave Hamamatsu Photonic System and Elite Lock-in Thermography training to cross functional team engineers. 6. Elite Lock-in Thermography System maintenance owner; achieved zero down time and maintaining system’s optimal condition for consecutive 5 years.
Semiconductors
Characterization
USB
Scanning Electron Microscopy
I2C
Failure Analysis
Win Tun Summary
Win Tun, based in San Jose, CA, US, is currently a Principal Failure Analysis Engineer at Analog Devices. Win Tun brings experience from previous roles at Maxim Integrated and Cypress Semiconductor. Win Tun holds a 2003 - 2005 Bachelor of Science (BS) in Electrical Engineering and Computer science @ University of California, Berkeley. With a robust skill set that includes Open Fault Isolation using HF Standing Wave, Semiconductor Failure Analysis, Fault Isolation: EMMI / OBIRCH / Lock-in Thermography / EBIC / EBAC / SCM, High Speed PCB design, Data Analysis and more. Win Tun has 3 emails and 1 mobile phone numbers on RocketReach.
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