Hardware Design Engineer @ L-3 Space & Sensors (January 2009 - September 2011)
William Spies Education
Northwestern University
Master of Science (M.S.) (Robotics)
2017-2018
University of Cincinnati
Bachelor of Science (B.S.) (Electrical Engineering)
2007-2012
William Spies Skills
Python
3D Printing
Altium Designer
AutoCAD
Boost C++
Budget Management
Budgeting
C++
CMake
CUDA
Catch2
Cross-functional Team Leadership
Cross-platform Development
Eagle
Eigen C++
Electrical Engineering
Elixir
Engineering Management
Git
Go (Programming Language)
JSON
LabVIEW
Laser Cutting
Laser Engraving
Laser Safety
Linux
MPLAB
MeshLab
Microsoft Excel
Microsoft PowerPoint
Microsoft Visio
Microsoft Visual Studio Code
Microsoft Word
Motion Planning
MoveIt 2
Onshape
OpenCV
OrCAD PSpice
PLC Programming
Point Cloud Library (PCL)
Printed Circuit Board (PCB) Design
Project Engineering
Project Planning
Python
ROS 2
RSLogix
Robot Operating System (ROS)
Robot Programming
Robotics
Software Development
Software Documentation
Team Leadership
ePlan Electric
William Spies Summary
William Spies, based in Denver, CO, US, is currently a Staff Software Engineer at UNION. William Spies brings experience from previous roles at Fenris Robotics, LLC., Reveal Technology, True Anomaly and Chembotix. William Spies holds a 2017 - 2018 Master of Science (M.S.) in Robotics @ Northwestern University. With a robust skill set that includes Python, 3D Printing, Altium Designer, AutoCAD, Boost C++ and more. William Spies has 4 emails on RocketReach.
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