William Pak Email & Phone Number
IC Design Engineer 4 - APD @ Broadcom
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William Pak Location
- Santa Clara, CA, US
William Pak Work
- 2025 -now IC Design Engineer 4 - APD @
- 2020 -2025 IC Design Engineer 4 - WCC @
- 2012 -2020 IC Design Engineer (1-3) @
William Pak Education
- Binghamton University
Bachelor of Science (Chinese Christian Fellowship)
2011
William Pak Skills
- Embedded Software
- Engineering Design
- Altera Quartus
- Sdio
- Digital Electronics
- Linux
- C
- Debugging
- Perl Script
- Windows
- Perl
- RTL design
- Matlab
- PCIe
- Analog
- ASIC
- Digital Design
- Verilog
- TCL
- Signal Processing
- Microsoft Office
- Bible
- Embedded Systems
- Electrical Engineering
- Communication Systems
- VHDL
- C++
- MPLAB
- Ubuntu
- Assembly
- Semiconductors
- Design
- System On Chip Design
- Pspice
- Simulink
- JTAG
- Shell Scripting
- CodeWarrior
- IC
William Pak Summary
- William Pak, based in Santa Clara, CA, US, is currently a IC Design Engineer 4 - APD at Broadcom. William Pak brings experience from previous roles at Broadcom. William Pak holds a Bachelor of Science in Chinese Christian Fellowship @ Binghamton University. With a robust skill set that includes Embedded Software, Engineering Design, Altera Quartus, Sdio, Digital Electronics and more. William Pak has 2 emails on RocketReach.
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