William Pak Email & Phone Number
IC Design Engineer 4 - APD @ Broadcom
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William Pak Location
- Santa Clara, CA, US
William Pak Work
- IC Design Engineer 4 - APD @ (November 2025 - Present)
- IC Design Engineer 4 - WCC @ (October 2020 - November 2025)
- IC Design Engineer (1-3) @ (June 2012 - October 2020)
William Pak Education
- Binghamton University
Bachelor of Science (Electrical Engineering)
2011
William Pak Skills
- ASIC
- Altera Quartus
- Analog
- C
- C++
- Chipset
- CodeWarrior
- Communication Systems
- Debugging
- Digital Design
- Digital Electronics
- Electrical Engineering
- Embedded Software
- Embedded Systems
- Engineering Design
- HBM
- JTAG
- Linux
- MPLAB
- Microsoft Office
- PCIe
- PHY
- Perl
- Perl Script
- RTL design
- SDIO
- Semiconductors
- Shell Scripting
- Signal Processing
- System-on-Chip Design
- SystemVerilog
- TCL
- Ubuntu
- Universal Verification Methodology (UVM)
- VHDL
- Verilog
- Windows
- Matlab
- Bible
- Assembly
- Design
- System On Chip Design
- Pspice
- Simulink
- IC
William Pak Summary
- William Pak, based in Santa Clara, CA, US, is currently a IC Design Engineer 4 - APD at Broadcom. William Pak brings experience from previous roles at Broadcom. William Pak holds a Bachelor of Science in Electrical Engineering @ Binghamton University. With a robust skill set that includes ASIC, Altera Quartus, Analog, C, C++ and more. William Pak has 2 emails and 2 mobile phone numbers on RocketReach.
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