William Pak Location
Santa Clara, CA, US
William Pak Work
- 2020 - now IC Design Engineer 4 @ Broadcom
- 2011 - 2020 IC Design Engineer 3 @ Broadcom
William Pak Education
William Pak Skills
William Pak Summary
William Pak, based in Santa Clara, CA, US, is currently a IC Design Engineer 4 at Broadcom Inc.. William Pak brings experience from previous roles at Broadcom Inc.. William Pak holds a Bachelor of Science in Electrical Engineering @ Binghamton University. With a robust skill set that includes Embedded Software, Engineering Design, Altera Quartus, Sdio, Digital Electronics and more. William Pak has 2 emails and 1 mobile phone numbers on RocketReach.