William Lewis Email & Phone Number
Vice President, Software Engineer @ JPMorgan Chase & Co.
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William Lewis Location
- New York, NY, US
William Lewis Work
- 2022 -now Vice President, Software Engineer @
- 2021 -2022 Senior Cyber Security Engineer @
- 2020 -2021 Security Engineer III @
- 2017 -2019 Associate, Infrastructure Engineer @
- 2016 -2017 Desktop Engineer @
- 2012 -2015 Enterprise Integrated Technical Analyst @
- 2006 -2012 Senior Systems Engineer @
- 2005 -2006 PC Support Specialist @
- 2005 -2005 Marketing Support Intern @
- 2004 -2004 Technical Operations Intern @
William Lewis Education
- Chubb Institute
Diploma (Network Security)
2004-2005 - Rochester Institute of Technology
(Computer Science)
William Lewis Skills
- Windows Server
- SCCM
- Active Directory
- Data Center
- ITIL
- Lotus Notes
- Microsoft Technologies
- Troubleshooting
- System Administration
- TCP/IP
- Batch Programming
- Virtualization
- Powershell
- IT Operations
- Windows XP
- Windows 7
- Technical Support
- SQL
- Hardware
- Security
- VMware
- IT Management
- Shell Scripting
- IT Service Management
- Start Ups
- Venture Capital
- Business Development
- Entrepreneurship
- Corporate Development
- Data Analysis
- Analytics
- Strategic Partnerships
- Management
- Business Planning
- Finance
- R
- Statistics
- Business Strategy
- Statistical Data Analysis
- Marketing Strategy
- Product Development
- Experimental Design
- Marketing
- Product Management
William Lewis Summary
- William Lewis, based in New York, NY, US, is currently a Vice President, Software Engineer at JPMorgan Chase & Co.. William Lewis brings experience from previous roles at Fiserv and JPMorgan Chase & Co.. William Lewis holds a 2004 - 2005 Diploma in Network Security @ Chubb Institute. With a robust skill set that includes Windows Server, SCCM, Active Directory, Data Center, ITIL and more. William Lewis has 2 emails and 4 mobile phone numbers on RocketReach.
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