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William Lei Location
Boston, MA, US
William Lei Work
2025 -now Mechanical Product Engineer @
2024 -2025 Mechanical Engineer @
2022 -2024 Mechanical Engineer @
2022 -2022 Mechanical Engineer @
2021 -2021 Mechanical Engineering Co-op @ TeraDiode, Inc.
2019 -2020 Mechanical Engineering Co-op @
William Lei Education
Northeastern University
B.S. Mechanical Engineering (Minor in Mathematics)
2017-2022
William Lei Summary
William Lei, based in Boston, MA, US, is currently a Mechanical Product Engineer at Boston Micromachines Corp. William Lei brings experience from previous roles at CPI Electron Device Business, Communications & Power Industries (CPI) and TeraDiode, Inc.. William Lei holds a 2017 - 2022 B.S. Mechanical Engineering in Minor in Mathematics @ Northeastern University.
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