William Lei Email & Phone Number
Mechanical Product Engineer @ Boston Micromachines Corp
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William Lei Location
- Boston, MA, US
William Lei Work
- Mechanical Product Engineer @ (May 2025 - Present)
- Mechanical Engineer @ (June 2024 - May 2025)
- Mechanical Engineer @ (May 2022 - June 2024)
- Mechanical Engineer @ (January 2022 - May 2022)
- Mechanical Engineering Co-op @ TeraDiode, Inc. (July 2021 - December 2021)
- Mechanical Engineering Co-op @ (July 2019 - December 2020)
William Lei Education
- Northeastern University
B.S. Mechanical Engineering (Minor in Mathematics)
2017-2022
William Lei Skills
- ANSYS
- Arduino
- AutoCAD
- C++
- Matlab
- Microsoft Excel
- Public Speaking
- SolidWorks
William Lei Summary
- William Lei, based in Boston, MA, US, is currently a Mechanical Product Engineer at Boston Micromachines Corp. William Lei brings experience from previous roles at CPI Electron Device Business, Communications & Power Industries (CPI) and TeraDiode, Inc.. William Lei holds a 2017 - 2022 B.S. Mechanical Engineering in Minor in Mathematics @ Northeastern University. With a robust skill set that includes ANSYS, Arduino, AutoCAD, C++, Matlab and more.
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