William Lees's Location
Lakeland, FL, US
William Lees's Work
- Hardware Engineer Sr @ Lockheed Martin
- Hardware Engineer @ Lockheed Martin
- Engineering LDP @ Lockheed Martin
- Engineering LDP Asc @ Lockheed Martin
- Associate System Engineer @ Lockheed Martin
- Engineering Intern @ Createch Machine & Design
- Student Research Assistant @ Florida Polytechnic University
- Indexing Manager @ Wise and Time Advertising
William Lees's Education
- Columbia Video Network
Master of Engineering - MEng (Electrical and Electronics Engineering)
2020 - 2022 - Cornell University
System engineer (Systems Engineering)
2019 - 2020 - Florida Polytechnic University
Bachelor of Engineering (BE) (Electrical and Electronics Engineering)
2014 - 2018
- University of North Dakota
Doctor of Philosophy - PhD (Electrical and Electronics Engineering)
2023
William Lees's Skills
- C++
- Python
- NI Multisim
- Breadboard
- 3d Prototyping
- AutoCAD
- Autodesk Inventor
- Solidworks
- Data Analysis
- Lathe
William Lees's Summary
William Lees, based in Lakeland, FL, US, is currently a Hardware Engineer Sr at Lockheed Martin, bringing experience from previous roles at Lockheed Martin. William Lees holds a 2020 - 2022 Master of Engineering - MEng in Electrical and Electronics Engineering @ Columbia Video Network. With a robust skill set that includes C++, Python, NI Multisim, Breadboard, 3d Prototyping and more, William Lees contributes valuable insights to the industry. William Lees has 3 emails and 1 mobile phone number on RocketReach.
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