Staff Software Engineer @ Conexant Systems (December 1999 - September 2001)
Software Engineer @ (November 1994 - December 1999)
William Higgins Education
North Dakota State University
MS (Electrical Engineering)
1992-1994
North Dakota State University
BS (Electrical and Electronics Engineering)
1987-1992
William Higgins Skills
ARM
Application-Specific Integrated Circuits (ASIC)
C
DSP
Debugging
Digital Signal Processors
Embedded Software
Embedded Systems
Firmware
GPS
Signal Processing
Software Development
Team Leadership
Virtual Teams
William Higgins Summary
William Higgins, based in Cedar Rapids, IA, US, is currently a Director at Samsung Semiconductor US. William Higgins brings experience from previous roles at CSR, SiRF Technology, Conexant Systems and Rockwell Collins. William Higgins holds a 1992 - 1994 MS in Electrical Engineering @ North Dakota State University. With a robust skill set that includes ARM, Application-Specific Integrated Circuits (ASIC), C, DSP, Debugging and more. William Higgins has 5 emails and 2 mobile phone numbers on RocketReach.
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