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William Heckman Location
Palatine, IL, US
William Heckman Work
2018 -now RF and Microwave Engineer @
2008 -2018 Sr Electrical Engineer @
now Co-Op @
William Heckman Education
Purdue University
B.S. (Electrical Engineering)
2003-2008
William Heckman Skills
Matlab
Pspice
Simulations
Electrical Engineering
Circuit Design
Systems Engineering
Orcad
PCB design
Cadence
Analog Circuit Design
Schematic Capture
Microwave Test Equipment
RF
Microwave
William Heckman Summary
William Heckman, based in Palatine, IL, US, is currently a RF and Microwave Engineer at Northrop Grumman. William Heckman brings experience from previous roles at Rockwell Collins and Hamilton Sundstrand. William Heckman holds a 2003 - 2008 B.S. in Electrical Engineering @ Purdue University. With a robust skill set that includes Matlab, Pspice, Simulations, Electrical Engineering, Circuit Design and more. William Heckman has 2 emails and 1 mobile phone numbers on RocketReach.
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