William Ding Email & Phone Number
Software Solutions Engineer @ Federal Reserve Bank of New York
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William Ding Location
- Scarsdale, NY, US
William Ding Work
- 2024 -now Software Solutions Engineer @
- 2021 -2024 Senior Consultant @
- 2021 -2021 Senior Software Engineer @
- 2020 -2021 Consultant and Developer Lead - Cloud Native Microservices Developer @
- 2015 -2020 Software Engineer @
- 2013 -2015 Software and Firmware Engineer @
- 2010 -2013 Design Engineer @
- 2009 -2009 Internship program @
William Ding Education
- NYU Tandon School of Engineering
MS (Electrical, Electronics and Communications Engineering)
2008-2010 - Beijing Institute of Technology
B.S. Degree (Mechantronical Engineering; 2008)
2004-2008
William Ding Skills
- Software Development
- Algorithms
- Spring Framework
- Programming
- Electronics
- Engineering
- R&D
- Testing
- Software
- Systems Design
- Microcontrollers
- Debugging
- ARM Architecture
- Object Oriented Design
- Front-end Development
- Software Design
- Embedded Systems
- C++
- Simulink
- C
- C#
- Java
- Python
- SQL
- jQuery
- JSON
- HTML/CSS
- Firmware
- .NET Framework
- Databases
- JavaScript
- RESTful WebServices
- Jakarta Persistence
- Spring Boot
- Servers
- Bash
- Spring MVC
- AWS Command Line Interface (CLI)
- Amazon S3
- Amazon Web Services (AWS)
- MongoDB
- Docker Products
- Lambda Expressions
- Back-End Web Development
- Microservices
- Spring Data
- Cloud Development
- IT Automation
- DevOps
- SDK development
- Microsoft Office
- Strategy
- Sensors
- Altium
- OrCAD Capture CIS
- PCB design
- PADS Layout
- Microsoft Excel
- DSP
- Electrical Engineering
- Matlab
- AutoCAD
- Net
- Orcad
- Signal Processing
- Elect
- Simulations
- Motor Control
- Linux
- Program Management
- Manufacturing
- Hardware Architecture
- Semiconductors
- Net Framework
William Ding Summary
- William Ding, based in Scarsdale, NY, US, is currently a Software Solutions Engineer at Federal Reserve Bank of New York. William Ding brings experience from previous roles at Federal Reserve Bank of New York, Optum, Capgemini and Crestron Electronics. William Ding holds a 2008 - 2010 MS in Electrical, Electronics and Communications Engineering @ NYU Tandon School of Engineering. With a robust skill set that includes Software Development, Algorithms, Spring Framework, Programming, Electronics and more. William Ding has 4 emails on RocketReach.
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