2018 -2022 Principal Embedded Software Engineer and Senior Engineering Manager at American Well @
2017 -2018 Firmware Engineer @
2014 -2017 Device Engineer @
2012 -2014 Research Engineer @
2011 -2011 Research And Development Intern @ Mitsubishi Kagaku Imaging Corp.
William Devine Education
University of Virginia
Bachelor of Science (B.S.) (Electrical and Electronics Engineering)
2010-2014
Norfolk Academy
High School Diploma
2006-2010
William Devine Skills
PowerPoint
Product Engineering
Linux
Microsoft Excel
Customer Service
Eclipse
Java
Debugging
Embedded Software
Android
Public Speaking
Python
Labview
Electrical Engineering
Microsoft Office
Project Management
Embedded Systems
Engineering
Matlab
Software Development
C
Programming
Circuit Design
Research
Leadership
Computer Architecture
Sensors
Research And Development R&D
Computer Vision
Computer Science
Wireless Technologies
Research and Development
William Devine Summary
William Devine, based in Arlington, VA, US, is currently a Lead Software Engineer, Platform at Hologic, Inc.. William Devine brings experience from previous roles at Amazon Global Robotics, American Well and MIT Lincoln Laboratory. William Devine holds a 2010 - 2014 Bachelor of Science (B.S.) in Electrical and Electronics Engineering @ University of Virginia. With a robust skill set that includes PowerPoint, Product Engineering, Linux, Microsoft Excel, Customer Service and more. William Devine has 4 emails and 2 mobile phone numbers on RocketReach.
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