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William Deng Location
New York, NY, US
William Deng Work
2017 -now CHIPS Cross Border Large Value Payment System @
2010 -2017 Vice President @
2006 -2010 Development Manager @
1997 -2006 Project Lead @
1994 -1997 Software Developer @
William Deng Education
Columbia University in the City of New York
Master
William Deng Skills
Investment Performance Analytics
Quantitative Research
Financial Engineering
Risk Management and Compliance
Business Process Management
Business Intelligence
Enterprise Architecture
Service-Oriented Architecture (SOA)
Information Security
Integration
Data Warehousing
Software Project Management
Agile Methodologies
Big Data
Machine Learning
Cloud Computing
Amazon Web Services (AWS)
DevOps
Requirements Analysis
Service Oriented Architecture Soa
Amazon Web Services Aws
William Deng Summary
William Deng, based in New York, NY, US, is currently a CHIPS Cross Border Large Value Payment System at The Clearing House. William Deng brings experience from previous roles at JP Morgan Chase, Morgan Stanley, Thomson Reuters and Rapp Collins Worldwide. William Deng holds a Master @ Columbia University in the City of New York. With a robust skill set that includes Investment Performance Analytics, Quantitative Research, Financial Engineering, Risk Management and Compliance, Business Process Management and more. William Deng has 2 emails on RocketReach.
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