William Chung's Location
Toronto, ON, CA
William Chung's Work
- Business Development Lead @ Pack-Smart Inc
- Product Specialist @ Huskey Injection Molding Syst
- Solutions Sales Engineer @ Huskey Injection Molding Syst
- Senior Project Engineer @ Vesuvius USA
- Project Engineer @ Vesuvius Digital Services
William Chung's Education
- University of Waterloo
MASc (Mechanical Engineering)
2005 - 2007 - University of Waterloo
BASc (Mechanical Engineering)
2000 - 2005
William Chung's Skills
- CAD
- Product Development
- Computational Fluid Dynamics
- OpenFOAM
- Product R&d
- Engineering
- Mechanical Engineering
- Product Design
- Modeling
- Project Management
William Chung's Summary
William Chung, based in Toronto, ON, CA, is currently a Business Development Lead at PACK-SMART INC. AUTOMATION, bringing experience from previous roles at Husky Technologies, Vesuvius USA and Vesuvius. William Chung holds a 2005 - 2007 MASc in Mechanical Engineering @ University of Waterloo. With a robust skill set that includes CAD, Product Development, Computational Fluid Dynamics, OpenFOAM, Product R&d and more, William Chung contributes valuable insights to the industry. William Chung has 1 email on RocketReach.
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