Will Rainey Email
Packaging Engineer @ Viacon PS
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Will Rainey Location
- Detroit, MI, US
Will Rainey Work
- Packaging Engineer @ (September 2024 - Present)
- Packaging Engineer @ (April 2023 - August 2024)
- Packaging Engineering Intern @ Green Cell Foam (May 2022 - April 2023)
Will Rainey Education
- Michigan State University
Bachelor's degree (Packaging Science)
2018-2022
Will Rainey Summary
- Will Rainey, based in Detroit, MI, US, is currently a Packaging Engineer at Viacon PS. Will Rainey brings experience from previous roles at TemperPack and Green Cell Foam. Will Rainey holds a 2018 - 2022 Bachelor's degree in Packaging Science @ Michigan State University. Will Rainey has 1 emails on RocketReach.
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