Will Chen Email
Principal Engineer, Advanced Packaging @ AMD
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Will Chen Location
- California, United States
Will Chen Work
- Principal Engineer, Advanced Packaging @ (March 2026 - Present)
- Project Manager @ (January 2025 - Present)
- Technical Manager, Advanced Packaging R and D @ (July 2022 - January 2025)
- Principal Engineer, Advanced Packaging R and D @ (December 2018 - June 2022)
- Package Failure Analysis Engineer @ (December 2016 - November 2018)
Will Chen Education
- National Tsing Hua University
Ph.D (Materials Science and Engineering)
Will Chen Skills
- Advanced packaging
- Cross-functional Team Leadership
- Failure Analysis
- Failure Mode and Effects Analysis (FMEA)
- Reliability Analysis
- Substrates
Will Chen Summary
- Will Chen, based in California, United States, is currently a Principal Engineer, Advanced Packaging at AMD. Will Chen brings experience from previous roles at TSMC. Will Chen holds a Ph.D in Materials Science and Engineering @ National Tsing Hua University. With a robust skill set that includes Advanced packaging, Cross-functional Team Leadership, Failure Analysis, Failure Mode and Effects Analysis (FMEA), Reliability Analysis and more. Will Chen has 2 emails on RocketReach.
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