WELCON Inc. Information

WELCON’s "diffusion bonding microchannels" can improve heat exchanger performance by up to 200 times in volume/performance ratio. "WEL-Cool H2C heat exchanger" is a hydrogen refueling station heat exchanger. 25% of the Japanese market share hydrogen refueling stations (HRS J2601 70MPa). It can be decreased the actual size of overall systems by 140% from systems currently in use at most hydrogen refueling stations (HRS) WW. http://www.welcon.co.jp/product/heatex/ Using Japanese craftsmanship and engineering expertise to bring diffusion bonding processes to the design and manufacturing of 3D hollow structure parts and the highest-performance heat exchange devices in the world. Diffusion bonding is a specialized niche of welding and fabrication. It creates structures that no other method can. WELCON Inc.is focused exclusively on diffusion bonding as the next fabrication frontier. Diffusion bonding (additive manufacturing) is the technology that produces 3D(three-dimensional) structures by stacking preprocessed metal sheets and bonding them without melting. Because bonding is done without melting, diffusion bonding is capable of forming channels (microchannels) as fine as capillaries, making a very large surface area within a small volume. Company details Website http://www.welcon.co.jp Headquarters Niigata City, Niigata Year founded 2006 Company type Public Company Company size 51-200 employees Specialties 3D hollow structure devices, Technology development related to diffusion bonding, Microchannel heat exchanger, High-density heat dissipation heatsink, Design and manufacture for thermal applications, and Hydrogen station intercooler/aftercooler specialist