Weidong Wang Email & Phone Number
Director, Global Package Engineering @ Allegro MicroSystems
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Weidong Wang Location
- Boston, MA, US
Weidong Wang Work
- Director, Global Package Engineering @ (January 2026 - Present)
- Director, Packaging Development and Applications @ (January 2024 - January 2026)
- Senior Manager, Package Development and Applications @ (January 2022 - January 2024)
- Package Development and Applications Manager @ (January 2021 - January 2022)
- Principal Packaging Engineer @ (January 2020 - January 2021)
- Senior Staff Packaging Engineer @ (January 2015 - January 2020)
- Principal Engineer @ (January 2007 - January 2015)
- Senior MEMS Packaging Engineer @ (January 2002 - January 2007)
- Development Engineer @ (January 1999 - January 2002)
- Principal Engineer @ Ramar Corporation (January 1998 - January 1999)
- Optoelectronic Project Scientist @ CoreTek., Inc. (January 1997 - January 1998)
- Post Doc. Research Associate @ (January 1995 - January 1997)
Weidong Wang Education
- Tsinghua University
Ph.D., M.S., B.S. (Electrical Engineering)
Weidong Wang Skills
- MEMS
- Fiber Optics
- Sensors
- Imaging
- Photonics
- Fabrication
- Optics
- Laser
- Metal Fabrication
- Product Development
- Simulations
- Digital Imaging
- Electronics
- R&D
Weidong Wang Summary
- Weidong Wang, based in Boston, MA, US, is currently a Director, Global Package Engineering at Allegro MicroSystems. Weidong Wang brings experience from previous roles at Allegro MicroSystems. Weidong Wang holds a Ph.D., M.S., B.S. in Electrical Engineering @ Tsinghua University. With a robust skill set that includes MEMS, Fiber Optics, Sensors, Imaging, Photonics and more. Weidong Wang has 2 emails and 2 mobile phone numbers on RocketReach.
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