Wei Su Email
Vice President (副总裁） @ AAC Technologies
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Wei Su Location
- Beijing, CN
Wei Su Work
- Vice President (副总裁） @ (January 2015 - Present)
- Director of Mechanical Engineering of Corporate R and T @ (February 2013 - January 2015)
- Director, High end products design and development- Hardware department of China R and D, @ (August 2008 - October 2012)
- Director Of Mechanical Engineering Department Of Motorola China R and D @ (May 2006 - August 2008)
- Mechnical Engineering Manager and Senior manager @ (September 2002 - June 2006)
- Sr Mechanical Engineer @ (June 1998 - September 2002)
- Mechanical Engineer @ (February 1996 - May 1998)
- Assistant Mechanical - Optical Engineer @ Beijing Second Optical Instrument Factory (August 1992 - December 1995)
Wei Su Education
- Beijing University of Technology
Bachelor's degree (Mechanical Engineering)
1987-1992
Wei Su Skills
- Mechanical design and development,
- Challenged ID realization and ME solution
- Deep experience on reasonable electronis product structure and ME design
- Whole product mechanical design and developement plan, direction management
- Electronics product project lead
- development issue analysis and trouble shooting
- DOE
- New product manufacture issue analysis and solution
- New product mass production development with supplier
- Supplier new product quality management
- Six sigma green belt
- Six Sigma
- Design
- Project Management
- Direction Management
- SME
- Mechanical Design
- Mechanical Design and Development
- Whole Product Mechanical Design and Developement Plan
- Engineering
- R&d
Wei Su Summary
- Wei Su, based in Beijing, CN, is currently a Vice President (副总裁） at AAC Technologies Holdings. Wei Su brings experience from previous roles at Lenovo Group and Motorola Mobility Technologies (China) Co., Ltd.. Wei Su holds a 1987 - 1992 Bachelor's degree in Mechanical Engineering @ Beijing University of Technology. With a robust skill set that includes Mechanical design and development,, Challenged ID realization and ME solution, Deep experience on reasonable electronis product structure and ME design, Whole product mechanical design and developement plan, direction management, Electronics product project lead and more.
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