Wei Chung Email
Section head of Product Engineer @ Winbond
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Wei Chung Location
- Taichung City, Taiwan, Taiwan
Wei Chung Work
- Section head of Product Engineer @ (March 2006 - Present)
- 封裝測試工程師 @ (August 2002 - March 2006)
Wei Chung Education
- 國立成功大學
碩士 (Engineering Science)
2000-2002
Wei Chung Skills
- User Experience
- Open Innovation
- Product Innovation
- Product Engineering
- R&D
- Failure Analysis
- Surfactants
- 積體電路
- 半導體
- 半導體產業
- 跨部門團隊領導
Wei Chung Summary
- Wei Chung, based in Taichung City, Taiwan, Taiwan, is currently a Section head of Product Engineer at Winbond. Wei Chung brings experience from previous roles at Nanya Technology. Wei Chung holds a 2000 - 2002 碩士 in Engineering Science @ 國立成功大學. With a robust skill set that includes User Experience, Open Innovation, Product Innovation, Product Engineering, R&D and more. Wei Chung has 1 emails on RocketReach.
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