Wayne Mu Email
Lead Engineer @ Boschman Advanced Packaging Technology
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Wayne Mu Location
- Duiven, GE, NL
Wayne Mu Work
- 2019 -now Lead Engineer @
- 2018 -2019 Senior component and system integration engineer @
- 2016 -2018 Microelectronics Packaging Engineer @
- 2012 -2016 Researcher PHD Student @
- 2012 -2014 Process Development Engineer @ SHT Smart High Tech AB
- 2011 -2012 Research Assistant @ Sino-Sweden Microsystem Integration Technology Center
- 2008 -2011 Master Student @ Guilin University of Electronic Technology
Wayne Mu Education
- Chalmers University of Technology
Doctor of Philosophy (Ph.D.) (Microelectronics and nanoscience technology)
2012-2016 - Guilin University of Electronic Technology
Master’s Degree (Mechatronics engineering)
2008-2011 - Guilin University of Electronic Technology
Bachelor’s Degree (Microeletronic engineering)
2004-2008
Wayne Mu Summary
- Wayne Mu, based in Duiven, GE, NL, is currently a Lead Engineer at Boschman Advanced Packaging Technology. Wayne Mu brings experience from previous roles at Fingerprint Cards, Chalmers University of Technology and SHT Smart High Tech AB. Wayne Mu holds a 2012 - 2016 Doctor of Philosophy (Ph.D.) in Microelectronics and nanoscience technology @ Chalmers University of Technology. Wayne Mu has 1 emails on RocketReach.
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