Wang Jin-Yi Email
Senior, IC package Process and manufacture Engineer @ QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
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Wang Jin-Yi Location
- Taiwan
Wang Jin-Yi Work
- 2021 -now Senior, IC package Process and manufacture Engineer @
- 2021 -2021 Subcon managemt, section manager @ S-group of Foxconn
- 2017 -2021 SQE, senior engineer @
- 2016 -2017 SQE, senior engineer @
- 2012 -2015 Integrated Process Engineer @
- 2012 -2013 R and D Engineer @ Siliconware Precision Industries
- 2000 -2000 Ｃhemical Engineer @ Taita Chemical Company
Wang Jin-Yi Education
- National Chung Hsing University
Master's degree (Chemical Engineering)
2010-2012
Wang Jin-Yi Skills
- Customer Service
- ESD control
- Project Planning
- Project Management
- Microsoft Office
- Material Engineering
- Project Engineering
- Phase Transfer
- Product Development
- Scanning Electron Microscopy
- Microsoft Excel
- Process Engineering
- Marketing
- Manufacturing
- Toefl Ibt 86 Score
- Elk Analysis
- Strategic Planning
- Program Management
- Continuous Improvement
- Engineering
- Electronic Packaging
- Focused Ion Beam
- Chemical Engineering
- Failure Analysis
Wang Jin-Yi Summary
- Wang Jin-Yi, based in Taiwan, is currently a Senior, IC package Process and manufacture Engineer at QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.. Wang Jin-Yi brings experience from previous roles at S-group of Foxconn, 群聯電子 PHISON Electronics, 華邦電子股份有限公司 and SPIL. Wang Jin-Yi holds a 2010 - 2012 Master's degree in Chemical Engineering @ National Chung Hsing University. With a robust skill set that includes Customer Service, ESD control, Project Planning, Project Management, Microsoft Office and more. Wang Jin-Yi has 2 emails on RocketReach.
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