Vuong do Email & Phone Number
Failure Analysis Engineer (Contract via TEKsystems) @ Apple
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Vuong do Location
- Santa Clara, CA, US
Vuong do Work
- Failure Analysis Engineer (Contract via TEKsystems) @ (December 2025 - Present)
- Materials Engineer Graduate Researcher @ (April 2023 - July 2026)
- Materials And Process Engineer Intern | AMA, Inc. supporting NASA @ (April 2025 - December 2025)
- Materials And Process Engineer @ (January 2023 - April 2024)
- Engineering Student in Integrated Circuit Design Lab @ (January 2020 - May 2020)
- Electroplating Process Development Engineer @ (May 2019 - November 2019)
- Material Engineer and Undergraduate Researcher @ UCSC Chen Research Group (May 2016 - December 2018)
Vuong do Education
- San José State University
Master's degree (Materials Engineering)
2020-2024 - University of California, Santa Cruz
Bachelor of Science (BS) (Chemistry)
2018
Vuong do Skills
- Analytical Chemistry
- Band Saw
- Clean Rooms
- Coatings
- Communication
- Composite Structures
- Composites
- Cyclic Voltammetry
- Design of Experiments (DOE)
- Drill Press
- EDX (Energy-Dispersive X-ray)
- Electrochemical Cell Assembly
- Electrochemical Characterization
- Electrochemistry
- Electroplating
- Ellipsometry
- Experimental Design
- Formulation
- Gamry
- High-Performance Liquid Chromatography (HPLC)
- ImageJ
- Java
- Laboratory Safety
- Laboratory Skills
- Manufacturing Processes
- Material Handling
- Materials Characterization
- Materials Science
- Matlab
- Mechanical Properties
- Mechanical Testing
- Microhardness Instruments
- Microscopy
- Microstructure
- Molding (Process)
- Nanoimprint Lithography
- Nanoparticle synthesis
- Optical Microscopy
- Physical Properties
- Plastics Engineering
- Polishing
- Precision Cutting
- Presentation Skills
- Presentations
- Problem Solving
- Process Engineering
- Profilometry Microscopy
- Research
- Resin Casting
- Rotating Disk Electrode (RDE)
- SEM (Scanning Electron Microscopy)
- Sample Preparation
- Spectroscopy
- Spectroscopy and Data Analysis
- Thermal Analysis
- Thermal Desktop
- Thin Film Characterization
- Thin Film Deposition
- UV/Vis Spectroscopy
- Written Communication
Vuong do Summary
- Vuong do, based in Santa Clara, CA, US, is currently a Failure Analysis Engineer (Contract via TEKsystems) at Apple. Vuong do brings experience from previous roles at San Jose State University, NASA - National Aeronautics and Space Administration and Applied Materials. Vuong do holds a 2020 - 2024 Master's degree in Materials Engineering @ San José State University. With a robust skill set that includes Analytical Chemistry, Band Saw, Clean Rooms, Coatings, Communication and more. Vuong do has 1 emails and 2 mobile phone numbers on RocketReach.
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