Udayan Verma Email
Engineering TD Manager (Substrates Packaging Technology Development) @ Intel Corporation
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Udayan Verma Location
- Chandler, AZ, US
Udayan Verma Work
- Engineering TD Manager (Substrates Packaging Technology Development) @ (October 2019 - Present)
- Supply Chain Management Engineer (Substrates Packaging Technology Development) @ (April 2019 - October 2019)
- Product Marketing Engineer, Network and Edge (NEX) - Industrial Solutions Division @ (April 2017 - April 2019)
- Module Engineering Manager, Ocotillo Technology Fab (OTF) @ (October 2006 - April 2017)
- Module Engineer, Ocotillo Technology Fab (OTF) @ (April 2004 - October 2006)
- Chemical Engineer and Manager @ Schering-Plough Research Institute (Now Merck) (September 2001 - April 2004)
- Module Engineer, Ocotillo Technology Fab (OTF) @ (September 2000 - September 2001)
- Chemical Engineer @ Schering-Plough Research Institute (Now Merck) (June 1997 - August 2000)
Udayan Verma Education
- Arizona State University
Doctor of Philosophy - PhD (Chemical Engineering)
2025-2028 - New Jersey Institute of Technology
Masters of Science (Chemical Engineering)
1998-2003 - Rutgers University
Bachelors of Science (Chemical Engineering)
1993-1997
Udayan Verma Skills
- Design of Experiments
- Engineering Management
- Lean Manufacturing
- Manufacturing
- Process Engineering
- R&D
- Root Cause Analysis
- SPC
- Semiconductors
- Six Sigma
- Technology Transfer
- Validation
Udayan Verma Summary
- Udayan Verma, based in Chandler, AZ, US, is currently a Engineering TD Manager (Substrates Packaging Technology Development) at Intel Corporation. Udayan Verma brings experience from previous roles at Intel Corporation. Udayan Verma holds a 2025 - 2028 Doctor of Philosophy - PhD in Chemical Engineering @ Arizona State University. With a robust skill set that includes Design of Experiments, Engineering Management, Lean Manufacturing, Manufacturing, Process Engineering and more. Udayan Verma has 2 emails on RocketReach.
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