Ts Lim Location
- Klang, MY
Ts Lim Work
- 2025 - now Technical Principal Engineer @
- 2013 - 2025 Technical Staff Package Development Engineer @
- 2012 - 2013 Senior Equipment Engineer @
- 2011 - 2012 Senior Packaging Engineer @
- 2007 - 2011 Advanced Package Development Engineer @
Ts Lim Education
- Universiti Sains Malaysia
Master's Degree (Material Engineering)
2003 - 2007
Ts Lim Skills
- Product Engineering
- Silicon
- Microsoft Office
- Reliability
- R&d
- APQP
- Semiconductors
- Troubleshooting
- Electronics Packaging
- Manufacturing
- Electronics
- JMP
- Materials Science
- Cross Functional Team Leadership
- SPC
- Process Simulation
- Process Engineering
- Characterization
- IC
- Leadership
- Thin Films
- ANSYS
- Design of Experiments
- Yield
- Microelectronics
- Packaging
- Engineering
- Failure Analysis
- FMEA
- Project Management
- Semiconductor Industry
- Microsoft Word
Ts Lim Summary
- Ts Lim, based in Klang, MY, is currently a Technical Principal Engineer at onsemi. Ts Lim brings experience from previous roles at onsemi, Texas Instruments and National Semiconductor. Ts Lim holds a 2003 - 2007 Master's Degree in Material Engineering @ Universiti Sains Malaysia. With a robust skill set that includes Product Engineering, Silicon, Microsoft Office, Reliability, R&d and more. Ts Lim has 2 emails on RocketReach.
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