Timothy Vielhaber's Location
Avon, Ohio, United States
Timothy Vielhaber's Work
- Sr. Hardware Engineer @ Ranpak
- Sr. Hardware Engineer @ Tyco Electronic Product Group
- Simulation Engineer @ Lockheed Martin
- Co-op Engineer @ National Security Agency
Timothy Vielhaber's Education
- The University of Akron
Master of Science (MS) (Electrical and Electronics Engineering)
1986 - 1990 - The University of Akron
Bachelor of Science (BS) (Electrical and Electronics Engineering)
1979 - 1984
Timothy Vielhaber's Skills
- Hardware Architecture
- Signal Integrity
- Digital Electronics
- Analog Circuit Design
- Debugging
- Microprocessors
- PCB design
- Analog
- Electronics
- Microcontrollers
Timothy Vielhaber's Summary
Timothy Vielhaber, based in Avon, Ohio, United States, is currently a Engineering Manager at LogiSync, bringing experience from previous roles at LogiSync LLC, Honeywell, Ranpak and Tyco Electronic Product Group. Timothy Vielhaber holds a 1986 - 1990 Master of Science (MS) in Electrical and Electronics Engineering @ The University of Akron. With a robust skill set that includes Hardware Architecture, Signal Integrity, Digital Electronics, Analog Circuit Design, Debugging and more, Timothy Vielhaber contributes valuable insights to the industry. Timothy Vielhaber has 1 email on RocketReach.
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