Tim Ting Email
Director of Assembly Front End @ NXP Semiconductors
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Tim Ting Location
- Taiwan
Tim Ting Work
- 2015 -now Director of Assembly Front End @
- 2012 -now Engineering Division Director @ ChipMOS semiconductor
- 2009 -2012 Industrialization Manager @
- 1999 -2009 Package Development Manager @ NXP Semiconductor
- 1998 -1999 Q and R Director @ SPC Corp
- 1998 -1998 Principal Engineer @ Production, Penmax Corp
- 1998 -1998 QA manager @ YUSCO
Tim Ting Education
- 國立成功大學
Master (Material Engineering)
1985-1991 - National Chen-Kung University
M.S (Material Engineering)
1985-1991
Tim Ting Summary
- Tim Ting, based in Taiwan, is currently a Director of Assembly Front End at NXP Semiconductors. Tim Ting brings experience from previous roles at ChipMOS semiconductor, NXP Semiconductors, NXP Semiconductor and SPC Corp. Tim Ting holds a 1985 - 1991 Master in Material Engineering @ 國立成功大學. Tim Ting has 3 emails on RocketReach.
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