BS Student, Co-op, Intern @ North Dakota State University (January 1994 - January 1999)
co-op @ (January 1996 - January 1998)
Tim Raap Education
North Dakota State University
Tim Raap Skills
Engineering
Virtualization
Project Engineering
Data Center
Teamwork
VMware Infrastructure
Commissioning
Electrical Design
Tim Raap Summary
Tim Raap, based in Altoona, WI, US, is currently a Principal Device and Sub-system Engineer at Collins Aerospace. Tim Raap brings experience from previous roles at Rockwell Collins, Cray Inc. and Silicon Logic Engineering. Tim Raap holds a North Dakota State University. With a robust skill set that includes Engineering, Virtualization, Project Engineering, Data Center, Teamwork and more. Tim Raap has 2 mobile phone numbers on RocketReach.
Looking for a different Tim Raap?
Find contact details for 700 million professionals.