Tim Klimek Email

Signal Integrity Senior Engineer @ OPENCHIP & SOFTWARE TECHNOLOGIES

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Tim Klimek Location

Rastatt, BW, DE

Tim Klimek Work

Signal Integrity Senior Engineer @ (November 2025 - Present)
Analog Engineer and Technical Lead SIPI and Layout Solutions @ Intel Deutschland GmbH (February 2019 - November 2025)
Senior Hardware Engineer - Simulation Signal and Power Integrity @ Intel Deutschland GmbH (September 2012 - November 2025)
Team and Projectleader - Development Qualification - Automotive Navigation Systems @ Harman Automotive Division (April 2003 - August 2012)
Development - Optics DLP Rearview Projectors @ BARCO (November 2001 - March 2003)
Development - Orthopedic Robotics @ RoSyRa i.G. (June 1998 - October 2001)
Development - Orthopedic Robotics @ Orto Maquet (May 1999 - May 2001)

Tim Klimek Education

F.H. Ulm
Dipl. Ing. (FH) (Medical Engineering)
1994-1999

Tim Klimek Skills

3D Fusion 360
Ansys HFSS
Automation of Simulation Processes
Basic Thermal Simulation - Ansys Icepak
Basics in thermal simulation (Ansys Icepak)
Board & Package Development
C++
CADENCE PowerSI Clarity PowerDC Optimizer
Collaboration and support for international teams (India, China, US, ...)
DDR3 DDR4 LPDDR4 DDR5 LPDDR5
Design of Experiment - JMP
Environment Qualification
IBIS modeling out of SPICE code
IdEM - S-Parameter Optimizing
JEDEC Reporting
PCIe / Ethernet / USB / Thunderbolt / ...
PCIe Gen3 Gen4 Gen5
PHYTON
Psychoacoustic
S-Parameter Extraction
SW Tool Development supporting Simulation
Signal & Power Integrity Simulation
Synopsis HSPICE
TCL-scripting (PowerSI, CLARITY, TopXP)
Team & Project Lead
Training & Mentoring Signal & Power Integrity
Voltage Drop / Current Density / AC Impedance
uC Programming (ESP series)
Simulation Signal Integrity - Parallel & Serial Bus Systems (Eye Quality / Cross
Simulation Power Integrity (DC Current Density / DC Voltage Drop / AC Impedance
Broadband SPICE (S-Parameter Analysis / Time Domain Reflection)
System SI / PowerSI / PowerDC / OptimizePI / Broadband SPICE / HSPICE
IBIS / Linear Model / FASE VERILOG
VBA / C / Perl / Python / Pascal / Basic / Fortran / LabView / Vee and others
Testautomation (LABView & µC Programming)
Data Analysis (DIAdem / OriginPro)
Climatic & Mechanical Testing (Temperature / Humidity / Vibration / Electrical O
Psychoacoustics
Team and Project Leading
Fortran
Humidity
C
HSPICE
Perl
Fase Verilog
Powersi
Simulation Power Integrity Dc Current Density
Basic
Vee and Others
Dc Voltage Drop
Vibration
Broadband Spice
Pascal
Ac Impedance
Data Analysis Diadem
Broadband Spice S Parameter Analysis
System Si
VBA
Labview
Simulation Signal Integrity
Cross
Climatic and Mechanical Testing Temperature
Originpro
Python
Powerdc
Time Domain Reflection
Ibis
Parallel and Serial Bus Systems Eye Quality
Linear Model
Optimizepi
Data Analysis
Parallel and Serial Bus Systems
Testautomation
Climatic and Mechanical Testing
Simulation Power Integrity

Tim Klimek Summary

Tim Klimek, based in Rastatt, BW, DE, is currently a Signal Integrity Senior Engineer at OPENCHIP & SOFTWARE TECHNOLOGIES. Tim Klimek brings experience from previous roles at Intel Deutschland GmbH, Harman Automotive Division and BARCO. Tim Klimek holds a 1994 - 1999 Dipl. Ing. (FH) in Medical Engineering @ F.H. Ulm. With a robust skill set that includes 3D Fusion 360, Ansys HFSS, Automation of Simulation Processes, Basic Thermal Simulation - Ansys Icepak, Basics in thermal simulation (Ansys Icepak) and more. Tim Klimek has 2 emails on RocketReach.