Tim Jiang Email & Phone Number
Vice President of Engineering @ JPMorgan Chase & Co.
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Tim Jiang Location
- Kowloon, Hong Kong
Tim Jiang Work
- Vice President of Engineering @ (January 2022 - Present)
- Vice President Engineering @ MORGAN STANLEY ASIA PACIFIC SERVICES LIMITED (July 2017 - December 2021)
- Principal Software R and D Engineer @ (September 2012 - July 2017)
- Staff Engineer (Software R and D) @ (November 2004 - September 2012)
- Senior Software Engineer and Research Staff @ (January 2003 - January 2004)
Tim Jiang Education
- Jiangsu University
Master's degree (Computer Science)
1998-2001
Tim Jiang Skills
- Algorithms
- Big Data
- C
- C++
- ClearCase
- Cloud Computing
- Debugging
- Device Drivers
- Electronics
- Embedded Systems
- Enterprise Storage
- Linux
- Low Latency
- OpenGL
- Operating Systems
- Perl
- Programming
- Semiconductors
- SoC
- Software Architecture
- Software Development
- Software Engineering
- UML(4+1view)
- Windows
- XML
- Leadership
- Public Speaking
- Business Development
- Program Management
- Microsoft Excel
- Management
- Uml4+1View
- UML
Tim Jiang Summary
- Tim Jiang, based in Kowloon, Hong Kong, is currently a Vice President of Engineering at JPMorgan Chase & Co.. Tim Jiang brings experience from previous roles at MORGAN STANLEY ASIA PACIFIC SERVICES LIMITED, EMC, Agilent/Verigy and Intel Corporation (China Software Lab). Tim Jiang holds a 1998 - 2001 Master's degree in Computer Science @ Jiangsu University. With a robust skill set that includes Algorithms, Big Data, C, C++, ClearCase and more. Tim Jiang has 3 emails on RocketReach.
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