Tim Ding Email
Sr. MGR R and D and Product Development Engineering @ TE Connectivity
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Tim Ding Location
- Shanghai, China
Tim Ding Work
- 2021 -now Sr. MGR R and D and Product Development Engineering @
- 2012 -2021 Mgr Product Development Engineering @
- 2007 -2012 Project leader @ Hi-p wireless(shanghai)
- 2006 -2007 Purchasing Supervisor @ Hi-p
- 2004 -2006 Product Engineer @
Tim Ding Education
- Huazhong Agricultural University
(Mechanical Engineering/Mechanical Technology/Technician)
2000-2004 - Wuhan University
Bachelor's Degree (Computer Science)
2002-2004
Tim Ding Skills
- Cross-functional Team Leadership
- Engineering Management
- Product Development
- Mechanical Engineering
- Supply Chain Management
- Program Management
- Injection Molding
- Supply Management
- Six Sigma
- FMEA
- DMAIC
- Engineering
- Manufacturing
- Electronics
- SPC
- Product Management
- Development
- Cross Functional Team Leadership
- Team Leadership
- Strategy Thinking
Tim Ding Summary
- Tim Ding, based in Shanghai, China, is currently a Sr. MGR R and D and Product Development Engineering at TE Connectivity. Tim Ding brings experience from previous roles at TE Connectivity, Hi-p wireless(shanghai), Hi-p and Foxconn. Tim Ding holds a 2000 - 2004 Huazhong Agricultural University. With a robust skill set that includes Cross-functional Team Leadership, Engineering Management, Product Development, Mechanical Engineering, Supply Chain Management and more. Tim Ding has 2 emails on RocketReach.
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