Principal Member of Technical Staff @ (August 2012 - January 2020)
Senior Member of Technical Staff @ (June 2006 - August 2012)
Director, Back-end Development and Operation @ ALLVIA, Inc. (August 2005 - June 2006)
Team Leader, Advanced Flip Chip Packaging Material @ (November 2004 - June 2005)
Member of Technical Staff @ (September 2002 - October 2004)
Technical Manager @ (August 1997 - September 2002)
Tie Wang Education
National University of Singapore
Doctor of Philosophy (Ph.D.) (Surface Science in Chemical Engineering)
Tie Wang Skills
ASIC
CMOS
IC
IC packaging
Mixed Signal
Semiconductor Industry
Semiconductors
Silicon
SoC
Software
Keys
Search
Tie Wang Summary
Tie Wang, based in California, United States, is currently a IC Packaging Integration Engineer at Apple. Tie Wang brings experience from previous roles at Qualcomm, Maxim Integrated and ALLVIA, Inc.. Tie Wang holds a Doctor of Philosophy (Ph.D.) in Surface Science in Chemical Engineering @ National University of Singapore. With a robust skill set that includes ASIC, CMOS, IC, IC packaging, Mixed Signal and more. Tie Wang has 1 mobile phone numbers on RocketReach.
Looking for a different Tie Wang?
Find contact details for 700 million professionals.