Tie Wang's Location
California, United States
Tie Wang's Work
- IC Packaging Integration Engineer @ Apple
- RF Front-End Module Packaging Engineer @ Qualcomm
- Principal Member of Technical Staff @ Maxim Integrated
- Senior Member of Technical Staff @ Maxim Integrated
- Director, Back-end Development and Operation @ ALLVIA, Inc.
- Team Leader, Advanced Flip Chip Packaging Material @ Ablestik Laboratories
- Member of Technical Staff @ JCET Group
- Technical Manager @ Advanpack Solutions Pte Ltd
Tie Wang's Education
- National University of Singapore
Doctor of Philosophy (Ph.D.) (Surface Science in Chemical Engineering)
1995 - 1999 - Dalian University of Technology
Master's Degree (Polymer Science in Chemical Engineering)
1984 - 1991
Tie Wang's Skills
- IC packaging
- IC
- Semiconductors
- Mixed Signal
- Semiconductor Industry
- SoC
- Silicon
- CMOS
- ASIC
- Software
Tie Wang's Summary
Tie Wang, based in California, United States, is currently a IC Packaging Integration Engineer at Apple, bringing experience from previous roles at Qualcomm, Maxim Integrated and ALLVIA, Inc.. Tie Wang holds a 1995 - 1999 Doctor of Philosophy (Ph.D.) in Surface Science in Chemical Engineering @ National University of Singapore. With a robust skill set that includes IC packaging, IC, Semiconductors, Mixed Signal, Semiconductor Industry and more, Tie Wang contributes valuable insights to the industry. Tie Wang has 2 emails on RocketReach.
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Maha AlEmam
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