Tie Wang Email & Phone Number
IC Packaging Integration Engineer @ Apple
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Tie Wang Location
- California, United States
Tie Wang Work
- 2022 -now IC Packaging Integration Engineer @
- 2020 -2022 RF Front-End Module Packaging Engineer @
- 2012 -2020 Principal Member of Technical Staff @
- 2006 -2012 Senior Member of Technical Staff @
- 2005 -2006 Director, Back-end Development and Operation @ ALLVIA, Inc.
- 2004 -2005 Team Leader, Advanced Flip Chip Packaging Material @
- 2002 -2004 Member of Technical Staff @
- 1997 -2002 Technical Manager @
Tie Wang Education
- National University of Singapore
Doctor of Philosophy (Ph.D.) (Surface Science in Chemical Engineering)
Tie Wang Skills
- IC packaging
- IC
- Semiconductors
- Mixed Signal
- Semiconductor Industry
- SoC
- Silicon
- CMOS
- ASIC
- Software
- Keys
- Search
Tie Wang Summary
- Tie Wang, based in California, United States, is currently a IC Packaging Integration Engineer at Apple. Tie Wang brings experience from previous roles at Qualcomm, Maxim Integrated and ALLVIA, Inc.. Tie Wang holds a Doctor of Philosophy (Ph.D.) in Surface Science in Chemical Engineering @ National University of Singapore. With a robust skill set that includes IC packaging, IC, Semiconductors, Mixed Signal, Semiconductor Industry and more. Tie Wang has 1 mobile phone numbers on RocketReach.
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