Tie Liu Email
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Tie Liu Location
- Beijing, China
Tie Liu Work
- 2022 -now VP @
- 2020 -2021 R and D director @
- 2018 -2020 HW Manager @
- 2012 -2018 Mechanical Engineering Manager (R and D) @
- 2011 -2012 R and D Line Manager @
- 2003 -2011 R and D Engineering Manager @
- 2001 -2003 Mechanical Structural Design Engineer @ MITAC Research Shanghai Corporation
Tie Liu Education
- 大连理工大学
Master (MOLD & DIE)
1994-2001
Tie Liu Summary
- Tie Liu, based in Beijing, China, is currently a VP at 北京天智航医疗科技股份有限公司. Tie Liu brings experience from previous roles at 北京天智航医疗科技股份有限公司, GE Healthcare and Nokia Siemens Networks. Tie Liu holds a 1994 - 2001 Master in MOLD & DIE @ 大连理工大学. Tie Liu has 1 emails on RocketReach.
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