Tie Liu Email
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Tie Liu Location
- Beijing, China
Tie Liu Work
- VP @ (January 2022 - Present)
- R and D director @ (June 2020 - December 2021)
- HW Manager @ (July 2018 - June 2020)
- Mechanical Engineering Manager (R and D) @ (July 2012 - July 2018)
- R and D Line Manager @ (May 2011 - July 2012)
- R and D Engineering Manager @ (February 2003 - April 2011)
- Mechanical Structural Design Engineer @ MITAC Research Shanghai Corporation (April 2001 - February 2003)
Tie Liu Education
- 大连理工大学
Master (MOLD & DIE)
1994-2001
Tie Liu Summary
- Tie Liu, based in Beijing, China, is currently a VP at 北京天智航医疗科技股份有限公司. Tie Liu brings experience from previous roles at 北京天智航医疗科技股份有限公司, GE Healthcare and Nokia Siemens Networks. Tie Liu holds a 1994 - 2001 Master in MOLD & DIE @ 大连理工大学. Tie Liu has 1 emails on RocketReach.
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