Tian Qiu's Location
Sunnyvale, CA, US
Tian Qiu's Work
- IC Packaging Design Lead @ Google
- IC Package Architect - Advanced IC Packaging @ Intel Corporation
- Analog Engineer - Signal Integrity and Power Integrity @ Intel Corporation
- Packaging R and D Engineer - Package Design @ Intel Corporation
- Research Assistant @ University of Pennsylvania
- Teaching Assistant @ University of Pennsylvania
Tian Qiu's Education
- University of Pennsylvania
Master's degree (Electrical and Electronics Engineering)
2012 - 2014 - Xidian University
Bachelor's degree (Electrical and Electronics Engineering)
2008 - 2012
Tian Qiu's Skills
- Cadence Schematic Capture
- Cadence Virtuoso
- HFSS
- Signal Integrity
- Cadence Sigrity
- Ic Packaging
- Radio Frequency Rf
- Antenna Design
- C
- Ads
Tian Qiu's Summary
Tian Qiu, based in Sunnyvale, CA, US, is currently a IC Packaging Design Lead at Google, bringing experience from previous roles at Intel Corporation and Center for Sensor Technologies, University of Pennsylvania. Tian Qiu holds a 2012 - 2014 Master's degree in Electrical and Electronics Engineering @ University of Pennsylvania. With a robust skill set that includes Cadence Schematic Capture, Cadence Virtuoso, HFSS, Signal Integrity, Cadence Sigrity and more, Tian Qiu contributes valuable insights to the industry. Tian Qiu has 1 email on RocketReach.
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