Thomas Wagner Email
Head of Packaging @ Corintis
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Thomas Wagner Location
- Neubiberg, BY, DE
Thomas Wagner Work
- 2025 -now Head of Packaging @
- 2024 -2025 Head of Packaging and Systems Technology @ Intel Deutschland GmbH
- 2022 -2024 Lead Mentor and technical expert @
- 2017 -2024 Head of Package Engineering Center @ Intel Deutschland GmbH
- 2015 -2017 Head of Package Technology and Innovation @ Intel Deutschland GmbH
- 2011 -2015 Package R and D Engineer @ Intel Deutschland GmbH
- 2006 -2011 Project Manager @
- 2004 -2006 Design for Testability Engineer @
- 2000 -2004 Test Engineer @
Thomas Wagner Education
- Technische Hochschule Nürnberg Georg Simon Ohm
Dipl.-Eng. (FH) (Microelectronics)
1994-2000
Thomas Wagner Summary
- Thomas Wagner, based in Neubiberg, BY, DE, is currently a Head of Packaging at Corintis. Thomas Wagner brings experience from previous roles at Intel Deutschland GmbH and Intel Ignite. Thomas Wagner holds a 1994 - 2000 Dipl.-Eng. (FH) in Microelectronics @ Technische Hochschule Nürnberg Georg Simon Ohm. Thomas Wagner has 2 emails on RocketReach.
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