Thomas Wagner Email
Head of Packaging @ Corintis
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Thomas Wagner Location
- Neubiberg, BY, DE
Thomas Wagner Work
- Head of Packaging @ (November 2025 - Present)
- Head of Packaging and Systems Technology @ Intel Deutschland GmbH (September 2024 - October 2025)
- Head of Package Engineering Center @ Intel Deutschland GmbH (May 2017 - September 2024)
- Head of Package Technology and Innovation @ Intel Deutschland GmbH (April 2015 - April 2017)
- Package R and D Engineer @ Intel Deutschland GmbH (February 2011 - March 2015)
- Lead Mentor and technical expert @ (May 2022 - October 2024)
- Project Manager @ (April 2006 - January 2011)
- Design for Testability Engineer @ (April 2004 - March 2006)
- Test Engineer @ (October 2000 - March 2004)
Thomas Wagner Education
- Technische Hochschule Nürnberg Georg Simon Ohm
Dipl.-Eng. (FH) (Microelectronics)
1994-2000
Thomas Wagner Summary
- Thomas Wagner, based in Neubiberg, BY, DE, is currently a Head of Packaging at Corintis. Thomas Wagner brings experience from previous roles at Intel Deutschland GmbH. Thomas Wagner holds a 1994 - 2000 Dipl.-Eng. (FH) in Microelectronics @ Technische Hochschule Nürnberg Georg Simon Ohm. Thomas Wagner has 2 emails on RocketReach.
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