Tezzaron® Semiconductor Corporation specializes in 3D wafer stacking and TSV processes. The company demonstrated the world's first successful wafer-stacked 3D-ICs back in 2004, including stacked microprocessors, stacked sensors, and stacked SRAM devices. With our DiRAM4 prototype complete, we are turning our attention to foundry and product partnerships that will allow the emergence of a robust ecosystem for all sorts of DisIntegrated 3D™ (Di3D™) products, including memories, FPGAs, ASICs, SOCs and more.
| Website | http://www.tezzaron.com |
| Revenue | $11 million |
| Employees | 17 (8 on RocketReach) |
| Founded | 1999 |
| Address | 7600 Chevy Chase Dr Bldg 2, Suite 300, Austin, Texas 78752, US |
| Phone | (630) 505-0404 |
| Fax | (650) 564-9398 |
| Technologies |
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| Industry | Manufacturing, Semiconductors, Electronics, Memory Devices, Software, 3D ICs, Wearables, Advanced Technologies, Consumer Electronics, Hardware |
| Web Rank | 19 Million |
| Keywords | Semiconductor Packaging, Advanced Packaging, Wafer Level Packaging, Heterogeneous Integration, Advanced Semiconductor, Integrated Circuits |
| Competitors | Intel Corporation, NVIDIA, Micron Technology, Infineon Technologies, Broadcom, Texas Instruments, AMD, Xilinx, Qualcomm, Skyworks Solutions, Inc. +40 more (view full list) |
| SIC | SIC Code 367 Companies, SIC Code 36 Companies |
| NAICS | NAICS Code 33 Companies, NAICS Code 334 Companies |
Looking for a particular Tezzaron Semiconductor employee's phone or email?
The Tezzaron Semiconductor annual revenue was $11 million in 2026.
James Ayers is the CEO, Chairman of the Board of Directors of Tezzaron Semiconductor.
8 people are employed at Tezzaron Semiconductor.
Tezzaron Semiconductor is based in Austin, Texas.
The NAICS codes for Tezzaron Semiconductor are [33, 334].
The SIC codes for Tezzaron Semiconductor are [367, 36].