Teng Yang Location

Beaverton, OR, US

Teng Yang Work

  • 2017 - now  SoC Design Engineer @ Intel Corporation
  • 2013 - 2017 Research Assistant @ VLSI Design lab at CISL, Columbia University
  • 2016 - 2016 Summer Intern @ IBM

Teng Yang Education

  • Columbia University in the City of New York

    Doctor of Philosophy (PhD) (Electrical and Electronics Engineering)

    2013 - 2017
  • Columbia University - Fu Foundation School of Engineering and Applied Science

    Master's degree (Electrical and Electronics Engineering)

    2010 - 2012
  • Beijing University of Post and Telecommunications

    Bachelor's degree (Telecommunications Engineering)

    2006 - 2010

Teng Yang Skills

  • LaTeX
  • Cadence Spectre
  • Vhdl/Verilog/Fpga
  • Cadence Virtuoso
  • Altium Designer
  • Matlab/Simulink

Teng Yang Summary

Teng Yang, based in Beaverton, OR, US, is currently a SoC Design Engineer at Intel Corporation. Teng Yang brings experience from previous roles at VLSI Design lab at CISL, Columbia University, IBM, CISL, Columbia University and Bionet (Prof. Lazar's Group), EE, SEAS, Columbia University. Teng Yang holds a 2013 - 2017 Doctor of Philosophy (PhD) in Electrical and Electronics Engineering @ Columbia University in the City of New York. With a robust skill set that includes LaTeX, Cadence Spectre, Vhdl/Verilog/Fpga, Cadence Virtuoso, Altium Designer and more. Teng Yang has 5 emails and 2 mobile phone numbers on RocketReach.

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