Teng Lim Email
Director of Packaging Engineering @ AMD
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Teng Lim Location
- Bayan Lepas, MY
Teng Lim Work
- 2025 -now Director of Packaging Engineering @
- 2008 -2024 Senior Engineering Manager @
- 2007 -2008 Front End Engineering Manager @
- 1997 -2007 Module Engineer @
Teng Lim Education
- University Technology Malaysia
Bachelor's degree (Electrical Engineering)
Teng Lim Skills
- NPI Program
- Sustainable Packaging
- Multichip Packaging
- Interposer Attach
- Thermal Compress Bonding
- Fab Integration
- Yield matching
- FMEA
- Technology Transfer
- Advanced Packaging
- NPI Management
- Flip Chip
- Chip attach
- Epoxy
- Reflow
- Lid attach
- Inteposer
- Test Operation
- Backend Engineering
- Die Attach
- Wire Bonding
- die prep
- wafer reflow
- Wafer Fab
- Lean Six Sigma
- Digitization
- JMP
- Business Metrics
- Team Performance
- Benchmarking
- Cross-functional Team Leadership
- Semiconductor Industry
- Team Motivation
- Optimization
- Leadership
- Safety Regulations
- Team Management
- Quality Control
- Process Optimization (Manufacturing)
- Manufacturing Processes
- Manufacturing Operations
- Critical Thinking
- Cost Reduction
- Continuous Improvement Culture
- Analytical Skills
- Packaging Engineering
- Packaging Design
- Supply Chain Management
- Industrial Engineering
- Warehouse Control
- Warehouse Automation
- Lean Warehousing
- Warehouse Operations
- Digital Transformation
- Digital Technology
- Simulations
- Process Simulation
- Modeling and Simulation
- Simulation Modeling
- Yield Management
- Yields
- Process Improvement
- Process Control
- Statistical Data Analysis
- Statistical Process Control (SPC)
- Statistics
- Product Development
- New Product Implementations
- People Management
Teng Lim Summary
- Teng Lim, based in Bayan Lepas, MY, is currently a Director of Packaging Engineering at AMD. Teng Lim brings experience from previous roles at Intel Corporation and NXP acquires Freescale Semiconductor. Teng Lim holds a Bachelor's degree in Electrical Engineering @ University Technology Malaysia. With a robust skill set that includes NPI Program, Sustainable Packaging, Multichip Packaging, Interposer Attach, Thermal Compress Bonding and more. Teng Lim has 2 emails on RocketReach.
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