Teng Lim Email

Director of Packaging Engineering @ AMD

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Teng Lim Location

Bayan Lepas, MY

Teng Lim Work

2025 - now Director of Packaging Engineering @ AMD
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2008 - 2024 Senior Engineering Manager @ Intel Corporation
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2007 - 2008 Front End Engineering Manager @ NXP acquires Freescale Semiconductor
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1997 - 2007 Module Engineer @ Intel Corporation
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Teng Lim Education

University Technology Malaysia
Bachelor's degree (Electrical Engineering)

Teng Lim Skills

NPI Program
Sustainable Packaging
Multichip Packaging

Interposer Attach
Thermal Compress Bonding
Fab Integration
Yield matching
FMEA
Technology Transfer
Advanced Packaging

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Teng Lim Summary

Teng Lim, based in Bayan Lepas, MY, is currently a Director of Packaging Engineering at AMD. Teng Lim brings experience from previous roles at Intel Corporation and NXP acquires Freescale Semiconductor. Teng Lim holds a Bachelor's degree in Electrical Engineering @ University Technology Malaysia. With a robust skill set that includes NPI Program, Sustainable Packaging, Multichip Packaging, Interposer Attach, Thermal Compress Bonding and more. Teng Lim has 2 emails on RocketReach.

Teng Lim Emails

Found 2 emails

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Teng Lim

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