TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding. In particular, our processing (technology) are using at the following fields. - Structured glass wafers for MEMS packaging - Glass micro fluidic for Drug discovery and Chemical reaction - Customized heatsinks for Laser Diode and LED We support your design and manufacturing with our Cross-edge technologies.
View Top Employees from TECNISCO, LTD.| Website | http://www.tecnisco.co.jp/en/ |
| Revenue | $70 million |
| Employees | 26 (26 on RocketReach) |
| Founded | 1970 |
| Technologies |
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| Industry | Semiconductors |
| Web Rank | 5 Million |
| Keywords | Tecnisco Advanced Materials, 株式会社テクニスコ, C Mount 孔, 陽極接合, テクニスコ広島工場 |
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The TECNISCO, LTD. annual revenue was $70 million in 2024.
Keizo Sekiya is the President of TECNISCO, LTD..
26 people are employed at TECNISCO, LTD..
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