TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding. In particular, our processing (technology) are using at the following fields. - Structured glass wafers for MEMS packaging - Glass micro fluidic for Drug discovery and Chemical reaction - Customized heatsinks for Laser Diode and LED We support your design and manufacturing with our Cross-edge technologies.
| Website | http://www.tecnisco.co.jp/en/ |
| Revenue | $70 million |
| Employees | 14 (13 on RocketReach) |
| Founded | 1970 |
| Phone | +81 3-3472-6991 |
| Technologies |
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| Industry | Semiconductors |
| Web Rank | 5 Million |
| Keywords | Precision Components, Processing Services, Component Processing, Precision Machining, Manufacturing Services, Subcontracting Manufacturing, High Precision Parts, Machined Parts, Metal Fabrication, Engineering Services, Technology Integration, Semiconductor Components, Electronic Components, Custom Machining, Precision Engineering, Contract Manufacturing, Parts Processing, Surface Finishing |
| Competitors | Mitsubishi Electric, Siemens, Schneider Electric, Rockwell Automation, Emerson, Honeywell, GE, ABB, OMRON Group, Yokogawa +44 more (view full list) |
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The TECNISCO, LTD. annual revenue was $70 million in 2026.
Keizo Sekiya is the President of TECNISCO, LTD..
13 people are employed at TECNISCO, LTD..