TASK provides innovative solutions to customers in need of high reliability miniaturization using state of the art assembly processes for manufacturability, specializing in Medical, Aerospace, Defense & Security and some high-end industrial markets. With over 35 years of deep industry experience in microelectronics, our core competencies allow sequential steps for design, proto, NPI, to volume production. Design & process engineering services: To get your complex devices to market faster, TASK’s products engineering team has the experience in helping customers miniaturize and/or ruggedize their new or existing designs with innovative packaging solutions based in the most current technologies. TASK works in conjunction with customers from initial design layout through validation, prototype, pre-production phases right to full production support. Complex multi process assemblies: Non-standard assembly challenge? One of a kind packaging needs? Combining multiple processes into a tiny solution? Our team has extensive experience from simple assemblies to complex combinations required to make your product work effectively. Thick film, SMT, die-attach, wire bonding, electrical test, encapsulation – or any combination of… Tell us your requirements, we will find a solution! Quality & Compliance: Quality comes from good documentation & processes. Our compliance adheres to ISO 13485:2016 / ISO 9001:2015 certified, AS9100D certified, FDA audited and registered, Medical Implantable devices, CGP, IPC-A-610, FAR/DFAR and MIL-STD-883 compliant. Do not hesitate to contact us at: sales@TASKmicro.com to discuss your design and manufacturing needs.
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The TASK Micro-Electronics Inc. annual revenue was $20.5 million in 2026.
Lindsay Bellevue is the Vice President Sales and Marketing of TASK Micro-Electronics Inc..
25 people are employed at TASK Micro-Electronics Inc..
TASK Micro-Electronics Inc. is based in Kirkland, Quebec.
The NAICS codes for TASK Micro-Electronics Inc. are [33, 334].
The SIC codes for TASK Micro-Electronics Inc. are [36, 367].