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Steve Payne Location
Hillsboro, OR, US
Steve Payne Work
President and Principal Engineer @ (January 2021 - Present)
Director of Electrical Engineering @ (September 2016 - Present)
President and Principal Engineer @ RVG (April 2010 - Present)
Reference Design Manager @ (December 2010 - September 2016)
Senior Director of Asic and Fpga Design @ LTX Credence Corp (September 2008 - April 2009)
Senior Director of Central Engineering @ (August 2006 - September 2008)
Senior Director of Asic Design @ (May 2004 - July 2006)
Director of Hardware Engineering @ (January 1998 - May 2004)
Asic Engineering Manager @ (September 1995 - January 1998)
Asic Design Engineer @ (January 1991 - September 1995)
Design Engineer @ (July 1989 - December 1991)
Steve Payne Education
Massachusetts Institute of Technology 1985-1989
Steve Payne Skills
Engineering
Semiconductors
Mixed Signal
Analog
ASIC
FPGA
Hardware Architecture
Testing
Electronics
PCB design
Manufacturing
C
Integration
Debugging
Photography
Steve Payne Summary
Steve Payne, based in Hillsboro, OR, US, is currently a President and Principal Engineer at Mobile Technologies Inc. (MTI). Steve Payne brings experience from previous roles at Mobile Technologies Inc. (Mti), RVG, Summit Semiconductor and LTX Credence Corp. Steve Payne holds a 1985 - 1989 Massachusetts Institute of Technology. With a robust skill set that includes Engineering, Semiconductors, Mixed Signal, Analog, ASIC and more. Steve Payne has 3 emails and 3 mobile phone numbers on RocketReach.
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