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Steve Payne Location
Hillsboro, OR, US
Steve Payne Work
2021 -now President and Principal Engineer @
2016 -now Director of Electrical Engineering @
2010 -now President and Principal Engineer @ RVG
2010 -2016 Reference Design Manager @
2008 -2009 Senior Director of Asic and Fpga Design @ LTX Credence Corp
2006 -2008 Senior Director of Central Engineering @
2004 -2006 Senior Director of Asic Design @
1998 -2004 Director of Hardware Engineering @
1995 -1998 Asic Engineering Manager @
1991 -1995 Asic Design Engineer @
1989 -1991 Design Engineer @
Steve Payne Education
Massachusetts Institute of Technology 1985-1989
Steve Payne Skills
Engineering
Semiconductors
Mixed Signal
Analog
ASIC
FPGA
Hardware Architecture
Testing
Electronics
PCB design
Manufacturing
C
Integration
Debugging
Photography
Steve Payne Summary
Steve Payne, based in Hillsboro, OR, US, is currently a President and Principal Engineer at Mobile Technologies Inc. (MTI). Steve Payne brings experience from previous roles at Mobile Technologies Inc. (Mti), RVG, Summit Semiconductor and LTX Credence Corp. Steve Payne holds a 1985 - 1989 Massachusetts Institute of Technology. With a robust skill set that includes Engineering, Semiconductors, Mixed Signal, Analog, ASIC and more. Steve Payne has 3 emails and 3 mobile phone numbers on RocketReach.
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