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Stan Boland Location
United Kingdom
Stan Boland Work
Board Member @ (January 2025 - Present)
Board Member @ (June 2024 - Present)
CEO @ (August 2015 - August 2023)
Chairman @ (January 2014 - November 2016)
CEO @ (March 2013 - December 2014)
SVP Mobile Communications @ (May 2011 - September 2012)
President and CEO @ (March 2002 - June 2011)
Vice President, DSL Business Unit @ (November 2000 - July 2001)
President and CEO @ (June 1999 - November 2000)
CEO @ (August 1997 - June 1999)
Finance Director, Director of Treasury and Tax, Group Treasurer @ ICL plc (subsidiary of Fujitsu Limited) (November 1990 - June 1997)
Asst Treasurer @ Bricom Group plc (December 1987 - November 1990)
Deputy Treasurer @ Bell Group/Bell Resources (May 1987 - December 1987)
Stan Boland Education
University of Cambridge
Master of Arts (Physics)
1978-1981
Stan Boland Skills
Semiconductors
Wireless
SoC
ASIC
Mobile Devices
Consumer Electronics
Embedded Systems
IC
Product Management
Mobile Communications
Digital Signal Processors
Embedded Software
Cross-functional Team Leadership
Analog
FPGA
Firmware
RF
Mixed Signal
Product Marketing
Start-ups
Electronics
LTE
Mergers
ARM
Cellular Communications
GSM
Mergers & Acquisitions
Integration
Start-up
Radio Frequency (RF)
Wireless Technologies
ARM Architecture
Application-Specific Integrated Circuits (ASIC)
Corporate Finance
Start Ups
Radio Frequency Rf
Mergers and Acquisitions
Cross Functional Team Leadership
Radio Frequency
Stan Boland Summary
Stan Boland, based in United Kingdom, is currently a Board Member at Deeptech Labs. Stan Boland brings experience from previous roles at Fractile, FiveAI, NMI and Neul. Stan Boland holds a 1978 - 1981 Master of Arts in Physics @ University of Cambridge. With a robust skill set that includes Semiconductors, Wireless, SoC, ASIC, Mobile Devices and more. Stan Boland has 1 emails and 1 mobile phone numbers on RocketReach.
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