B.E, Electronics and Communication Engineering (B.E, Electronics and Communication Engineering)
Srikanth Kulkarni Skills
Development
Packaging
Technology
HFSS
Signal Integrity
PVD
Flotherm
Photolithography
Reliability
Electronics Packaging
Allegro Package Designer
Cob
MEMS
Parasitic Extraction
JMP
Thin Films
Decision Analysis
Technical Writing
Characterization
SAN
Allegro
Semiconductor Industry
Package Design
Data Presentation
Design of Experiments
ANSYS
Process Development
Electromagnetic Simulation
Manufacturing
Microelectronics
Power Integrity
CVD
Failure Analysis
Q3d
Dca
Task Management
SMT
Packaging Engineering
Semiconductor Process
R&d
Klarity Ace
Process Simulation
Silicon
Data Analysis
Srikanth Kulkarni Summary
Srikanth Kulkarni, based in California, United States, is currently a Sr. Staff Engineer at Qualcomm. Srikanth Kulkarni brings experience from previous roles at IDT - Integrated Device Technology, Inc., Maxim Integrated, Micron Technology and Global Power Electronics. Srikanth Kulkarni holds a M.S, Microelectronic Packaging in M.S, Microelectronic Packaging @ University of Idaho. With a robust skill set that includes Development, Packaging, Technology, HFSS, Signal Integrity and more. Srikanth Kulkarni has 4 emails and 1 mobile phone numbers on RocketReach.
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