Sow Foo Email
Senior Packaging R and D Engineer @ Intel Corporation
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Sow Foo Location
- Ipoh, MY
Sow Foo Work
- Senior Packaging R and D Engineer @ (July 2019 - Present)
- Senior Packaging R and D Engineer @ (July 2019 - Present)
- Technical Program Manager (NPI) @ (July 2017 - June 2019)
- Physical Design Engineer @ Oppstar Technology (January 2016 - June 2016)
- Package Design Engineer @ (March 2005 - September 2015)
- NPI Production Supervisor @ (April 2004 - February 2005)
- Production Supervisor @ (October 2002 - April 2004)
- Production Process Technician @ TFP Industries Sdn. Bhd. (August 1999 - October 2002)
- Technical Assistant @ Digimatic Technology (April 1998 - April 1999)
- Draftsperson @ Zaidun Leeng Sdn. Bhd. (January 1997 - June 1997)
Sow Foo Education
- The Nottingham Trent University
BTEC HND (Electrical and Electronics Engineering)
1997-1998 - Port Dickson Polytechnic
Certificate In Electrical Power Engineering (Electrical and Electronics Engineering)
1995-1997
Sow Foo Summary
- Sow Foo, based in Ipoh, MY, is currently a Senior Packaging R and D Engineer at Intel Corporation. Sow Foo brings experience from previous roles at Intel Corporation, TF AMD Microelectronics Penang and Oppstar Technology. Sow Foo holds a 1997 - 1998 BTEC HND in Electrical and Electronics Engineering @ The Nottingham Trent University. Sow Foo has 3 emails on RocketReach.
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