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SISPAD provides an international forum for presenting leading edge research and development results in the area of process and device simulation. SISPAD is under sponsorship of the IEEE Electron Devices Society (EDS). It is held annually, with the location of the conference circulating among Europe, Asia and the U.S. SISPAD is one of the longest running conferences devoted to semiconductor modeling. One of the unique strengths of SISPAD is its size. SISPAD attracts approximately 200 participants from around the world. The conference is the right size to allow for attendees to foster relationships and to relax among their peers. SISPAD will have invited speakers who will present new ideas about device and process physics, demonstrate applications to leading edge technologies, and show new models for compact devices.

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Sispad is based in Erlangen, Bavaria.

The NAICS codes for Sispad are [33, 334].

The SIC codes for Sispad are [36, 367].

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