Simon le, based in California, United States, is currently a Principal Firmware Test Engineer at Micron Technology. Simon le brings experience from previous roles at HGST, a Western Digital brand, Western Digital, Mindspeed Technologies and Huawei Technologies. Simon le holds a 1997 - 1999 Master @ University of Science and Technology of China. With a robust skill set that includes Debugging, ARM, Device Drivers, Embedded Software, SoC and more. Simon le has 2 emails and 3 mobile phone numbers on RocketReach.
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