Siddarth Kumar Email & Phone Number
Senior Technical Program Manager, Advanced 2.5D and 3D Packaging Pathfinding @ Intel Corporation
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Siddarth Kumar Location
- Chandler, AZ, US
Siddarth Kumar Work
- 2022 -now Senior Technical Program Manager, Advanced 2.5D and 3D Packaging Pathfinding @
- 2016 -2022 Technical Program Manager (Q and R) @
- 2016 -2016 Staff Quality Reliability R and D Engineer @
- 2011 -2016 Senior Quality Reliability R and D Engineer @
- 2006 -2011 PhD candidate @
- 2010 -2010 R and D Intern, Performance Technologies Lab @
- 2006 -2007 Research Assistant @
- 2004 -2006 M.S. Candidate @
Siddarth Kumar Education
- Massachusetts Institute of Technology
Doctor of Philosophy (Ph.D.) (Mechanical Engineering)
2006-2011 - Massachusetts Institute of Technology
Master of Science (M.S.) (Mechanical Engineering)
2004-2006 - Indian Institute of Technology, Delhi
BTech (Production and Industrial Engineering)
2000-2004
Siddarth Kumar Skills
- Semiconductors
- Biomechanics
- Simulation
- Experimentation
- Reliability
- Simulations
- Finite Element Analysis
- Scanning Electron Microscopy
- Numerical Analysis
- LaTeX
- Fluid Mechanics
- AFM
- Microfabrication
- Materials Science
- Sensors
- R&D
- MEMS
- Thin Films
- Characterization
- Packaging
- Technology
- Industrial Engineering
- Semiconductor Packaging
- Intel
- Research And Development R&D
- Testing
- Design of Experiments
- Features
- Design
- Research and Development
Siddarth Kumar Summary
- Siddarth Kumar, based in Chandler, AZ, US, is currently a Senior Technical Program Manager, Advanced 2.5D and 3D Packaging Pathfinding at Intel Corporation. Siddarth Kumar brings experience from previous roles at Intel Corporation and MIT. Siddarth Kumar holds a 2006 - 2011 Doctor of Philosophy (Ph.D.) in Mechanical Engineering @ Massachusetts Institute of Technology. With a robust skill set that includes Semiconductors, Biomechanics, Simulation, Experimentation, Reliability and more. Siddarth Kumar has 4 emails and 1 mobile phone numbers on RocketReach.
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