Shengmin Wen's Location
Phoenix, Arizona, United States
Shengmin Wen's Work
- Vice President and General Manager, Design Service @ JCET Group
- Principal Packaging Architect, Manager of Design and Testing @ Synaptics Incorporated
- Director, Senior Manager @ Amkor Technology, Inc.
- Quality Manager @ Qimonda
- Senior Manager: Product Engineering and Test @ Infineon Technologies
- Quality Manager @ Infineon Technologies
- Engineer, Si Technology Reliability @ Infineon Technologies
Shengmin Wen's Education
- Northwestern University
PhD ( Applied Mechanics)
1998 - 2001
Shengmin Wen's Skills
- 3D Packaging
- fine pitch flip chip
- PoP package
- flip chip package
- PMP
- Failure Analysis
- Product Engineering
- Semiconductors
- SPC
- Reliability
Shengmin Wen's Summary
Shengmin Wen, based in Phoenix, Arizona, United States, is currently a Vice President and General Manager, Design Service at Jcet Group Co., Ltd., bringing experience from previous roles at Synaptics, Amkor Technology, Qimonda and Infineon Technologies. Shengmin Wen holds a 1998 - 2001 PhD in Applied Mechanics @ Northwestern University. With a robust skill set that includes 3D Packaging, fine pitch flip chip, PoP package, flip chip package, PMP and more, Shengmin Wen contributes valuable insights to the industry. Shengmin Wen has 4 emails on RocketReach.
5 free lookups per month.
No credit card required.
If you need more lookups,
subscriptions start at $48 USD/month.
Not the Shengmin Wen you were looking for?
Find contact details for 700 million professionals.
People Like Shengmin Wen
-
35+
Top JCET Group Employees
-
2
-
12
-
12
-
11
-
1
-
33
-
41
-
22
-
1
-
1
-
2
How It Works
Get a Free Account
Sign up for a free account. No credit card required. Up to 5
free lookups / month.
Search
Search over 700
million verified professionals across 35 million companies.
Get Contact Info
Get contact details including emails and phone numbers
(business & personal).
G2Crowd Trusted
300K+
Plugin Users
