Shane Boyd Email & Phone Number
Mems Development Engineer @ FUJIFILM Dimatix, Inc.
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Shane Boyd Location
- San Jose, CA, US
Shane Boyd Work
- 2018 -now Mems Development Engineer @
- 2015 -2018 Senior Mts, Process Engineering @
- 2012 -2015 Senior Engineer, Process and Development @
- 2012 -2014 Contract Editor @
- 2006 -2011 Graduate Teaching and Research Assistant @
- 2008 -2008 Frontier Device Research Center Intern @
- 2005 -2005 D1d Financial Forecasting Intern @
- 2004 -2004 Chemical Mechanical Polish Engineering Intern @
- 2003 -2003 Components Research Chemical Mechanical Polish Intern @
- 2002 -2002 High-K Dielectric Thin Films Intern @
- 2001 -2001 Fab18 Etch Technician Intern @
Shane Boyd Education
- University of Washington
Ph.D. (Materials Science & Engineering)
2006-2011 - University of Washington
M.S.E. (Technical Japanese)
2006-2009 - University of Washington
BS (Material Science and Engineering)
2001-2006 - 早稲田大学
Japanese
2003-2004 - Aloha High School 1997-2001
Shane Boyd Skills
- Japanese
- Laboratory
- Spectroscopy
- Polymer Characterization
- Organic Synthesis
- Photolithography
- Scanning Electron Microscopy
- Semiconductor Manufacturing
- Nanotechnology
- Nanomaterials
- Materials
- Engineering
- Thin Films
- Semiconductor
- Characterization
- Grounding
- Organic Chemistry
- Design of Experiments
- Manufacturing
- Mass Spectrometry
- Polymers
- Electrochemistry
- Laboratory Research
- Semiconductors
- Research
- SPC
- Science
- AFM
- Bacon
- Materials Science
- Hugs
Shane Boyd Summary
- Shane Boyd, based in San Jose, CA, US, is currently a Mems Development Engineer at Fujifilm Dimatix, Inc.. Shane Boyd brings experience from previous roles at Maxim Integrated, Eworld Solutions and University of Washington. Shane Boyd holds a 2006 - 2011 Ph.D. in Materials Science & Engineering @ University of Washington. With a robust skill set that includes Japanese, Laboratory, Spectroscopy, Polymer Characterization, Organic Synthesis and more. Shane Boyd has 3 emails and 3 mobile phone numbers on RocketReach.
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